Invention Grant
- Patent Title: Metal pads with openings in integrated circuits
- Patent Title (中): 集成电路中具有开口的金属焊盘
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Application No.: US13764569Application Date: 2013-02-11
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Publication No.: US09245833B2Publication Date: 2016-01-26
- Inventor: Shuo-Mao Chen , Yu-Ting Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L23/525
Abstract:
A device includes a metal pad, and a passivation layer including portions overlapping edge portions of the metal pad. A Post-Passivation-Interconnect (PPI) includes a trace portion overlying the passivation layer, and a pad portion connected to the trace portion. A polymer layer includes an upper portion over the PPI, and a plug portion extending into, and encircled by, the pad portion of the PPI.
Public/Granted literature
- US20140061898A1 Metal Pads with Openings in Integrated Circuits Public/Granted day:2014-03-06
Information query
IPC分类:
