Invention Grant
US09245863B2 Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights
有权
由包括具有不同高度的第一和第二焊球的半导体封装形成的半导体封装装置
- Patent Title: Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights
- Patent Title (中): 由包括具有不同高度的第一和第二焊球的半导体封装形成的半导体封装装置
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Application No.: US13943037Application Date: 2013-07-16
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Publication No.: US09245863B2Publication Date: 2016-01-26
- Inventor: Hae-jung Yu , Hak-kyoon Byun , Kyung-tae Na , Seung-hun Han , Tae-sung Park , Choong-bin Yim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0109258 20120928
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/12 ; H01L23/04 ; H01L23/00 ; H01L23/498 ; H01L25/10 ; H01L23/14
Abstract:
According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls.
Public/Granted literature
- US20140091463A1 SEMICONDUCTOR PACKAGE APPARATUS Public/Granted day:2014-04-03
Information query
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