Invention Grant
- Patent Title: Package-on-package electronic devices including sealing layers and related methods of forming the same
- Patent Title (中): 包装封装电子器件，包括密封层及其相关方法
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Application No.: US14288440Application Date: 2014-05-28
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Publication No.: US09245867B2Publication Date: 2016-01-26
- Inventor: Choongbin Yim , Hae-Jung Yu , Taesung Park
- Applicant: Choongbin Yim , Hae-Jung Yu , Taesung Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2012-0038268 20120413
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/00 ; H01L23/10 ; H01L25/10 ; H01L21/56 ; H01L25/065
Abstract:
A package-on-package (POP) electronic device may include first and second packaging substrates, a solder interconnection providing electrical and mechanical coupling between the first and second packaging substrates, and first and second sealing layers between the first and second packaging substrates. The first and second sealing layers may be respective first and second epoxy sealing layers. Moreover, the second epoxy sealing layer may include a solder flux agent, and the first epoxy sealing layer may have a lower concentration of the solder flux agent than the second epoxy sealing layer.
Public/Granted literature
- US20140273348A1 PACKAGE-ON-PACKAGE ELECTRONIC DEVICES INCLUDING SEALING LAYERS AND RELATED METHODS OF FORMING THE SAME Public/Granted day:2014-09-18
Information query
IPC分类:
