Invention Grant
- Patent Title: Method for manufacturing a chip package
- Patent Title (中): 制造芯片封装的方法
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Application No.: US13534144Application Date: 2012-06-27
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Publication No.: US09245868B2Publication Date: 2016-01-26
- Inventor: Holger Torwesten , Manfred Mengel
- Applicant: Holger Torwesten , Manfred Mengel
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L23/29 ; H01L23/495 ; H01L23/31 ; H01L21/56

Abstract:
A method for manufacturing a chip package is provided, the method including: forming a layer arrangement over a carrier; arranging a chip including one or more contact pads over the layer arrangement wherein the chip covers at least part of the layer arrangement; and selectively removing one or more portions of the layer arrangement and using the chip as a mask such that at least part of the layer arrangement covered by the chip is not removed.
Public/Granted literature
- US20140001634A1 CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE Public/Granted day:2014-01-02
Information query
IPC分类: