Invention Grant
US09245868B2 Method for manufacturing a chip package 有权
制造芯片封装的方法

Method for manufacturing a chip package
Abstract:
A method for manufacturing a chip package is provided, the method including: forming a layer arrangement over a carrier; arranging a chip including one or more contact pads over the layer arrangement wherein the chip covers at least part of the layer arrangement; and selectively removing one or more portions of the layer arrangement and using the chip as a mask such that at least part of the layer arrangement covered by the chip is not removed.
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