Invention Grant
US09245869B2 Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
有权
用于将具有接触元件的芯片紧固到具有用于芯片接触元件的开口的功能层的基板上的方法
- Patent Title: Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements
- Patent Title (中): 用于将具有接触元件的芯片紧固到具有用于芯片接触元件的开口的功能层的基板上的方法
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Application No.: US14395084Application Date: 2013-03-18
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Publication No.: US09245869B2Publication Date: 2016-01-26
- Inventor: Jurgen Burggraf , Markus Wimplinger , Harald Wiesbauer , Alfred Sigl
- Applicant: EV GROUP E. THALLNER GMBH
- Applicant Address: AT St. Florian
- Assignee: EV Group E. Thallner GmbH
- Current Assignee: EV Group E. Thallner GmbH
- Current Assignee Address: AT St. Florian
- Agency: Kusner & Jaffe
- Priority: DE102012103430 20120419
- International Application: PCT/EP2013/055556 WO 20130318
- International Announcement: WO2013/156234 WO 20131024
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L21/56 ; H01L25/065 ; H01L25/00
Abstract:
A method for tacking of chips onto a substrate at chip positions which are distributed on a surface of the substrate. The method includes the following steps: formation or application of a function layer onto the substrate, removing the function layer from the substrate at the chip positions at least in the region of contacts to uncover the contacts, tacking chips onto one chip contact side of the function layer at the chip positions and contacting the chips with the contacts via contact elements.
Public/Granted literature
Information query
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