Invention Grant
- Patent Title: Performance boost by silicon epitaxy
- Patent Title (中): 硅外延的性能提升
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Application No.: US14187850Application Date: 2014-02-24
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Publication No.: US09245974B2Publication Date: 2016-01-26
- Inventor: Yu-Hung Cheng , Cheng-Ta Wu , Yeur-Luen Tu , Chia-Shiung Tsai , Ru-Liang Lee , Tung-I Lin , Wei-Li Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L29/66

Abstract:
The present disclosure relates to a method of generating a transistor device having an epitaxial layer disposed over a recessed active region. The epitaxial layer improves transistor device performance. In some embodiments, the method is performed by providing a semiconductor substrate. An epitaxial growth is performed to form an epitaxial layer onto the semiconductor substrate. An electrically insulating layer is then formed onto the epitaxial layer, and a gate structure is formed onto the electrically insulating layer. By forming the epitaxial layer over the semiconductor substrate the surface roughness of the semiconductor substrate is improved, thereby improving transistor device performance.
Public/Granted literature
- US20150243763A1 PERFORMANCE BOOST BY SILICON EPITAXY Public/Granted day:2015-08-27
Information query
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