Invention Grant
- Patent Title: IGBT with buried emitter electrode
- Patent Title (中): IGBT埋入发射极
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Application No.: US13791589Application Date: 2013-03-08
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Publication No.: US09245985B2Publication Date: 2016-01-26
- Inventor: Yi Tang , Niraj Ranjan , Chiu Ng
- Applicant: International Rectifier Corporation
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Farjami & Farjami LLP
- Main IPC: H01L29/739
- IPC: H01L29/739

Abstract:
There are disclosed herein various implementations of an insulated gate bipolar transistor (IGBT) with buried emitter electrodes. Such an IGBT may include a collector at a bottom surface of a semiconductor substrate, a drift region having a first conductivity type situated over the collector, and a base layer having a second conductivity type opposite the first conductivity type situated over the drift region. In addition, such an IGBT may include deep insulated trenches extending from a semiconductor surface above the base layer, into the drift region, each of the deep insulated trenches having a buried emitter electrode disposed therein. The IGBT may further include an active cell including an emitter, a gate trench with a gate electrode disposed therein, and an implant zone situated, between adjacent deep insulated trenches. The implant zone is formed below the base layer and has the first conductivity type.
Public/Granted literature
- US20130256744A1 IGBT with Buried Emitter Electrode Public/Granted day:2013-10-03
Information query
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