Invention Grant
- Patent Title: Packaging structure of light emitting diode and method of manufacturing the same
- Patent Title (中): 发光二极管的封装结构及其制造方法
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Application No.: US14232443Application Date: 2012-03-14
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Publication No.: US09246052B2Publication Date: 2016-01-26
- Inventor: Jinmin Li , Hua Yang , Xiaoyan Yi , Junxi Wang
- Applicant: Jinmin Li , Hua Yang , Xiaoyan Yi , Junxi Wang
- Applicant Address: CN Beijing
- Assignee: Institute of Semiconductors, Chinese Academy of Sciences
- Current Assignee: Institute of Semiconductors, Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: McDermott Will & Emery LLP
- Priority: CN201110198226 20110715; CN201110198263 20110715
- International Application: PCT/CN2012/072310 WO 20120314
- International Announcement: WO2013/010389 WO 20130124
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/15 ; H01L29/22 ; H01L33/06 ; H01L33/48 ; H01L33/62 ; H01L23/00 ; H01L33/00 ; H01L33/56 ; H01L33/58 ; H01L33/38
Abstract:
The present disclosure relates to a light emitting diode packaging structure and the method of manufacturing the same. The light emitting diode packaging structure has an insulating substrate with through holes formed on each side of the upper surface thereof, the through hole being filled with conductive metal. Additionally, a n-type layer, an active layer, a p-type layer, an insulating layer and a p-type electrode are formed on the insulating substrate. The structure further may include a n-type electrode provided on a side of the upper surface of the n-type layer; a first back electrode provided at one side of the back surface of the insulating substrate; a second back electrode provided at the other side of back surface of the insulating substrate; and an optical element packaged on the base substrate.
Public/Granted literature
- US20140264266A1 PACKAGING STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-09-18
Information query
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