An electrical connection assembly is provided to electrically connect with at least one electrical contact of an electronic apparatus. The electrical connection assembly includes an insulating casing, a circuit board and a resilient conductive element. An inner space is defined in the insulating casing, and at least one opening is defined on the insulating casing for communicating the inner space and the exterior of the insulating casing. The circuit board is disposed in the inner space of the insulating casing. The resilient conductive element includes a connecting side for fixing on and electrically connecting with the circuit board. The resilient conductive element further includes a compressible side for facing the opening and being exposed therethrough. The thickness of the resilient conductive element is reduced when an external force is applied thereon and recovers when the external force is removed.