Invention Grant
- Patent Title: Wiring harness
- Patent Title (中): 线束
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Application No.: US13992359Application Date: 2011-12-07
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Publication No.: US09246316B2Publication Date: 2016-01-26
- Inventor: Tatsuya Oga
- Applicant: Tatsuya Oga
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Brian S. Matross
- Priority: JP2010-275707 20101210
- International Application: PCT/JP2011/078844 WO 20111207
- International Announcement: WO2012/077826 WO 20120614
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02 ; H02G15/115

Abstract:
A wiring harness includes a first power transmission path; a second power transmission path; a connecting part; and a connector. The first power transmission path has stiffness ensuring autonomously retention of its shape, the shape coinciding with an arrangement path. The second power transmission paths have stiffness smaller than that of the first power transmission path and also have flexibility. The connecting part includes a connection structure configured to connect conductive ends of the first power transmission path and the second power transmission paths to each other with the conductive ends being electrically insulated from outside.
Public/Granted literature
- US20130248246A1 WIRING HARNESS Public/Granted day:2013-09-26
Information query
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