Invention Grant
- Patent Title: Sealing wiring holes in electronic devices
- Patent Title (中): 密封电子设备中的接线孔
-
Application No.: US13826430Application Date: 2013-03-14
-
Publication No.: US09247335B2Publication Date: 2016-01-26
- Inventor: Tristan Edward Taylor , Aaron Michael Reich
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: Bose Corporation
- Current Assignee: Bose Corporation
- Current Assignee Address: US MA Framingham
- Main IPC: H02G3/22
- IPC: H02G3/22 ; H04R1/10 ; H02G3/08

Abstract:
A wall separates a first volume from a second volume and has a hole allowing passage between the first volume and the second volume. A wire passes through the hole, and a gasket surrounds the wire at the hole. The gasket includes a first section including a groove between a first flange and a second flange, the groove has an outer diameter matched to the diameter of the hole and the flanges have outer diameters greater than the diameter of the hole. A second section adjacent the first flange includes a tubular portion having a diameter less than the diameter of the hole and a tapered section smoothly transitioning from the diameter of the tubular portion to the diameter of the first flange. The gasket prevents flow of fluid through the hole between the first volume and the second volume.
Public/Granted literature
- US20140270221A1 Sealing Wiring Holes in Electronic Devices Public/Granted day:2014-09-18
Information query
IPC分类: