Invention Grant
- Patent Title: Speaker module
- Patent Title (中): 扬声器模块
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Application No.: US14303548Application Date: 2014-06-12
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Publication No.: US09247341B2Publication Date: 2016-01-26
- Inventor: Yu-Sheng Lee , Lei Chen
- Applicant: HTC Corporation
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H04R1/04 ; H04R1/28 ; H05K5/00 ; H04R1/00

Abstract:
A speaker module includes a speaker unit, a main body and a speaker carrier. The main body includes a sound outlet opening and an air pressure regulating structure. The sound outlet opening is configured to expose the speaker unit. The speaker carrier is configured to carry the speaker unit. The speaker carrier is disposed in the main body together with the speaker unit, and forms a resonance space with the main body. The air pressure regulating structure is configured to regulate the air pressure of the resonance space.
Public/Granted literature
- US20150245132A1 SPEAKER MODULE Public/Granted day:2015-08-27
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