Invention Grant
US09247633B2 Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board
有权
用于大容量模块的外围电路的电路板，以及包括使用该电路板的外围电路的高容量模块
- Patent Title: Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board
- Patent Title (中): 用于大容量模块的外围电路的电路板，以及包括使用该电路板的外围电路的高容量模块
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Application No.: US13770335Application Date: 2013-02-19
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Publication No.: US09247633B2Publication Date: 2016-01-26
- Inventor: Takami Hirai , Shinsuke Yano , Tsutomu Nanataki , Hirofumi Yamaguchi
- Applicant: NGK Insulators, Ltd.
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2011-144356 20110629; JP2011-255014 20111122
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K1/02 ; H01L23/373 ; H01L23/498 ; H01L23/64 ; H01L25/16 ; H05K1/03 ; H05K1/14 ; H05K1/16 ; H05K3/00 ; H01L23/00
Abstract:
A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released.
Public/Granted literature
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