Invention Grant
- Patent Title: Printed circuit boards fabricated using congruent molds
- Patent Title (中): 使用一致模具制造的印刷电路板
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Application No.: US13887807Application Date: 2013-05-06
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Publication No.: US09247649B2Publication Date: 2016-01-26
- Inventor: Craig N. DeVarney
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Thompson Hine LLP
- Agent Anthony J. Canale
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K3/04

Abstract:
Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.
Public/Granted literature
- US20140326483A1 PRINTED CIRCUIT BOARDS FABRICATED USING CONGRUENT MOLDS Public/Granted day:2014-11-06
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