Invention Grant
- Patent Title: Slab-based cooling
- Patent Title (中): 平板式冷却
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Application No.: US13924100Application Date: 2013-06-21
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Publication No.: US09247659B1Publication Date: 2016-01-26
- Inventor: Matthew Thomas Phillips
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lee & Hayes, PLLC
- Main IPC: F25D23/12
- IPC: F25D23/12 ; H05K7/20 ; H05K5/02

Abstract:
Air conditioning systems and techniques are described that include passing a fluid through a slab. The fluid is cooled in the slab and the cooled fluid is circulated to a coil. The coil is arranged in an airflow such that ambient air passes over the coil, thereby reducing the relative humidity of the ambient air. A control unit may also be provided to selectively operate a pump to control the flow of the fluid through the slab.
Information query
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