Jet impingement assemblies and power electronics devices incorporating jet impingement assemblies are described. The jet impingement assemblies include a fluid inlet, a fluid outlet, a manifold, and a heat distribution member. The manifold includes a distribution side in fluid communication with the fluid inlet, a collection side in fluid communication with the fluid outlet, a plurality of orifices extending from the distribution side to the collection side, and a return channel extending from the collection side to the distribution side. The heat distribution member is positioned proximate to the collection side of the manifold.