Invention Grant
US09248492B2 Thermal transfer panels with channel structures and method of using thermal transfer panels
有权
具有通道结构的热转印面板和使用热转印面板的方法
- Patent Title: Thermal transfer panels with channel structures and method of using thermal transfer panels
- Patent Title (中): 具有通道结构的热转印面板和使用热转印面板的方法
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Application No.: US13611492Application Date: 2012-09-12
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Publication No.: US09248492B2Publication Date: 2016-02-02
- Inventor: Michael G. Sullivan , Diane Reker
- Applicant: Michael G. Sullivan , Diane Reker
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: B21D39/06
- IPC: B21D39/06 ; B23P15/26 ; F24H9/06 ; B21D47/00 ; F24F5/00 ; F24D3/12 ; F24D3/14 ; E04C1/39 ; F24D13/02 ; E04F13/08

Abstract:
A panel system has an insulating material with a first channel disposed over a surface of the insulating material. A transporter is disposed over the first channel. A thermal transfer medium is disposed over the surface of the first panel to attain desired surface characteristics. The first panel includes a second channel intersecting the first channel. A second panel includes a second channel. The first panel is adjacent to the second panel. The first and second channels of the adjacent first and second panels are aligned. The transporter is disposed over the first and second channels. The first and second panels are mounted over a mounting surface. Keyways are formed in the channels. Retention clips are disposed over the keyways. Panels include panel wings with hinges mounted over the panel wings. The thermal transfer medium includes graphite. The transporter includes tubing.
Public/Granted literature
- US20140069605A1 Thermal Transfer Panels With Channel Structures and Method of Using Thermal Transfer Panels Public/Granted day:2014-03-13
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