Invention Grant
- Patent Title: Cutting apparatus and method
- Patent Title (中): 切割装置和方法
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Application No.: US13558950Application Date: 2012-07-26
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Publication No.: US09248534B2Publication Date: 2016-02-02
- Inventor: Hirozi Nishikawa
- Applicant: Hirozi Nishikawa
- Applicant Address: JP Tokyo
- Assignee: FUJI JUKOGYO KABUSHIKI KAISHA
- Current Assignee: FUJI JUKOGYO KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agent Konomi Takeshita
- Priority: JP2011-170119 20110803
- Main IPC: B23P25/00
- IPC: B23P25/00 ; B23K26/08 ; B23K26/00 ; B23C1/00

Abstract:
A cutting device 1 comprises: a guiderail (18) that is formed into a ring shape along the circumference around the central axis (10c) of a cutting drive unit (10); a laser irradiation unit (22) that is movable along the guiderail, and irradiates a laser at a predetermined inclination angle onto an object (30) to be cut; a preset cutting position derivation unit (26a) for deriving a preset cutting position that corresponds to a preset cutting portion, which is the portion to be cut by a cutting tool (10b) after a predetermined amount of time; a stopping position derivation unit (26b) for deriving the stopping position of the laser irradiation unit on the guiderail with the preset cutting position that was derived as a target; and a laser irradiation drive unit (24) for moving the laser irradiation unit to the derived stopping position.
Public/Granted literature
- US20130032015A1 CUTTING APPARATUS AND METHOD Public/Granted day:2013-02-07
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