Invention Grant
US09248534B2 Cutting apparatus and method 有权
切割装置和方法

Cutting apparatus and method
Abstract:
A cutting device 1 comprises: a guiderail (18) that is formed into a ring shape along the circumference around the central axis (10c) of a cutting drive unit (10); a laser irradiation unit (22) that is movable along the guiderail, and irradiates a laser at a predetermined inclination angle onto an object (30) to be cut; a preset cutting position derivation unit (26a) for deriving a preset cutting position that corresponds to a preset cutting portion, which is the portion to be cut by a cutting tool (10b) after a predetermined amount of time; a stopping position derivation unit (26b) for deriving the stopping position of the laser irradiation unit on the guiderail with the preset cutting position that was derived as a target; and a laser irradiation drive unit (24) for moving the laser irradiation unit to the derived stopping position.
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