Invention Grant
- Patent Title: Electrostatic chuck, mount plate support, and manufacturing method of electrostatic chuck
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Application No.: US14198779Application Date: 2014-03-06
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Publication No.: US09248635B2Publication Date: 2016-02-02
- Inventor: Hideo Eto , Yasuhiro Nojiri , Makoto Saito
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-165351 20130808
- Main IPC: H01T23/00
- IPC: H01T23/00 ; B32B37/12 ; H01L21/67 ; H01L21/683
Abstract:
According to one embodiment, an electrostatic chuck comprises a mount plate, a first layer, and a second layer. The first layer includes a heater. The second layer is provided between the mount plate and the first layer. The second layer transmits heat from the heater to the mount plate. The second layer includes a compressive attachment portion. The compressive attachment portion is formed at the outer edge. The face on the mount plate side of the compressive attachment portion is compressed and attached to the mount plate. The face on the first layer side of the compressive attachment portion is compressed and attached to the first layer.
Public/Granted literature
- US09370920B2 Electrostatic chuck, mount plate support, and manufacturing method of electrostatic chuck Public/Granted day:2016-06-21
Information query
