Invention Grant
- Patent Title: Composition for injection molding, sintered compact, and method for producing sintered compact
- Patent Title (中): 注射成型用组合物，烧结体和烧结体的制造方法
-
Application No.: US13688855Application Date: 2012-11-29
-
Publication No.: US09249292B2Publication Date: 2016-02-02
- Inventor: Nobuyuki Hamakura , Hidefumi Nakamura
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-262956 20111130
- Main IPC: C09B67/00
- IPC: C09B67/00 ; C22C29/00 ; C08L59/00
Abstract:
A composition for injection molding includes: an inorganic powder composed of at least one of a metal material and a ceramic material; and a binder containing a polyacetal-based resin and an ethylene-glycidyl methacrylate-based copolymer. In the composition, the ethylene-glycidyl methacrylate-based copolymer is contained in an amount of 1% by mass or more and 30% by mass or less with respect to the amount of the polyacetal-based resin.
Public/Granted literature
- US20150376397A1 COMPOSITION FOR INJECTION MOLDING, SINTERED COMPACT, AND METHOD FOR PRODUCING SINTERED COMPACT Public/Granted day:2015-12-31
Information query
