Invention Grant
- Patent Title: Integrated molded product
- Patent Title (中): 集成成型产品
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Application No.: US13823711Application Date: 2011-08-17
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Publication No.: US09249296B2Publication Date: 2016-02-02
- Inventor: Kouichi Sakata
- Applicant: Kouichi Sakata
- Applicant Address: JP Toyko
- Assignee: POLYPLASTICS CO., LTD.
- Current Assignee: POLYPLASTICS CO., LTD.
- Current Assignee Address: JP Toyko
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2010-208889 20100917
- International Application: PCT/JP2011/068614 WO 20110817
- International Announcement: WO2012/035922 WO 20120322
- Main IPC: B32B7/04
- IPC: B32B7/04 ; B32B7/12 ; B32B25/04 ; B32B25/08 ; B32B25/20 ; B32B27/08 ; B32B27/18 ; B32B27/28 ; B32B27/36 ; C08L67/02 ; C08L67/03 ; C08L83/04 ; C09J183/04 ; C08K3/32 ; C08K5/49 ; C08K5/51 ; C08K5/52 ; C08K5/521 ; C08K5/524 ; C08K5/53 ; C08K5/5313 ; C08K5/5317 ; C08K5/5333 ; C08J5/12 ; C08K3/00 ; C08K5/00

Abstract:
To provide a technique in which a phosphorus compound does not inhibit curing of an addition reaction type silicone-based composition even though the addition reaction type silicone-based composition is in contact with a resin molded product containing the phosphorus compound. An integrated molded product including a thermoplastic resin molded product containing a phosphorus compound, an addition reaction type silicone-based composition, and a member, in which: the thermoplastic resin molded product is in contact with the addition reaction type silicone-based composition; and a pentavalent phosphorus compound is used as the phosphorus compound. The thermoplastic resin molded product preferably contains a polybutylene terephthalate resin in light of heat resistance.
Public/Granted literature
- US20130274390A1 INTEGRATED MOLDED PRODUCT Public/Granted day:2013-10-17
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