Invention Grant
- Patent Title: Connector assembly for modular ground covering panels
- Patent Title (中): 模块化地面覆盖板的连接器组件
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Application No.: US13916834Application Date: 2013-06-13
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Publication No.: US09249570B2Publication Date: 2016-02-02
- Inventor: Neri Jean
- Applicant: Everest Plastik Inc.
- Applicant Address: CA Tracadie-Sheila CA Edmonton
- Assignee: 670988 NB INC.,GSM SOLUTIONS INC.
- Current Assignee: 670988 NB INC.,GSM SOLUTIONS INC.
- Current Assignee Address: CA Tracadie-Sheila CA Edmonton
- Agency: Bereskin & Parr LLP/S.E.N.C.R.L., s.r.l.
- Main IPC: E04B5/02
- IPC: E04B5/02 ; E01C5/00 ; E01C13/00 ; E01C13/04 ; E01C5/20 ; E01C5/22 ; E01C9/08

Abstract:
A system for constructing a load bearing surface includes a plurality of modular ground covering panels. Along at least one first side edge of each of the panels, the lower surface projects beyond the upper surface to define a lower peripheral tab. Along at least one second side edge of each of the panels, the upper surface projects beyond the lower surface to define an upper peripheral tab. The lower peripheral tab of one of the panels and the upper peripheral tab of another one of the panels overlappingly engage so that the upper surfaces of the panels are in adjoining relation to form the load bearing surface. A connector assembly includes a first connection element fixed to the lower peripheral tab, and a second connection element that releasably fastens the upper peripheral tab to the first connection element to secure the panels together.
Public/Granted literature
- US20140137505A1 CONNECTOR ASSEMBLY FOR MODULAR GROUND COVERING PANELS Public/Granted day:2014-05-22
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