Invention Grant
- Patent Title: Fan module
- Patent Title (中): 风扇模块
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Application No.: US13794962Application Date: 2013-03-12
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Publication No.: US09249808B2Publication Date: 2016-02-02
- Inventor: Chun-Ming Lu , Wen-Cheng Hu , Chun-Ying Yang , Yen-Cheng Lin , Ming-Hung Shih , Ying-Chao Peng
- Applicant: Inventec (Pudong) Technology Corporation , Inventec Corporation
- Applicant Address: CN Shanghai TW Taipei
- Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee: INVENTEC (PUDONG) TECHNOLOGY CORPORATION,INVENTEC CORPORATION
- Current Assignee Address: CN Shanghai TW Taipei
- Agency: Huffman Law Group, PC
- Priority: CN201210470807 20121120
- Main IPC: F04D29/00
- IPC: F04D29/00 ; F04D29/66 ; F16F15/02 ; G06F1/20 ; F04D25/06 ; F04D29/60

Abstract:
A fan module includes a casing, a fan, and two vibration absorption assemblies. The casing has an accommodating space. The fan is located in the accommodating space and keeps a distance from the casing. Each of the two vibration absorption assemblies includes two first vibration absorption components and a second vibration absorption component. The two first vibration absorption components are respectively in contact with the fan and separated from the casing, respectively. The second vibration absorption component is connected with two first vibration absorption components and the casing, respectively. The first vibration absorption components and the second vibration absorption components are adapted for absorbing the vibration waves having different frequency ranges.
Public/Granted literature
- US20140140816A1 FAN MODULE Public/Granted day:2014-05-22
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