Invention Grant
US09250027B2 Thermal management structures for optoelectronic systems 有权
光电子系统的热管理结构

Thermal management structures for optoelectronic systems
Abstract:
An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.
Public/Granted literature
Information query
Patent Agency Ranking
0/0