Invention Grant
- Patent Title: Thermal management structures for optoelectronic systems
- Patent Title (中): 光电子系统的热管理结构
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Application No.: US13874960Application Date: 2013-05-01
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Publication No.: US09250027B2Publication Date: 2016-02-02
- Inventor: Cindy H. Hsieh
- Applicant: FINISAR CORPORATION
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F9/00 ; H05K1/02 ; G02B6/42 ; H01R13/66 ; H05K1/14

Abstract:
An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.
Public/Granted literature
- US20140329405A1 THERMAL MANAGEMENT STRUCTURES FOR OPTOELECTRONIC SYSTEMS Public/Granted day:2014-11-06
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