A measurement apparatus for measuring a substrate, on which a measurement object is formed, and a correction method of the same is shown. The correction method includes measuring a reference phase by measuring a phase of a substrate for measuring the reference phase by using an image-capture part, acquiring a tilted pose of a reference plane of the measured reference phase to an image plane of the image-capture part, and calculating a height that is required to correct the reference plane with regard to the image-capture part based on the tilted pose. Therefore, based on a tilted pose of a reference phase in order to correct a reference plane being a reference of measuring a height, a measurement credibility of the measurement object may be improved.