Invention Grant
- Patent Title: Temperature measurement circuitry and system
- Patent Title (中): 温度测量电路和系统
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Application No.: US13624619Application Date: 2012-09-21
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Publication No.: US09250137B2Publication Date: 2016-02-02
- Inventor: David R. Welland
- Applicant: David R. Welland
- Applicant Address: US TX Austin
- Assignee: Silicon Laboratories Inc.
- Current Assignee: Silicon Laboratories Inc.
- Current Assignee Address: US TX Austin
- Agency: Cesari & Reed LLP
- Agent R. Michael Reed
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/01

Abstract:
A method includes alternately coupling a selected one of a plurality of current sources and two or more of the plurality of current sources to a first terminal of a bipolar device during first and second phases of a modulator cycle of a plurality of modulator cycles. The method further includes providing sampled voltages from the first terminal of the bipolar device to a modulator to produce a modulator output signal, filtering the modulator output signal to produce a filtered output signal using a back-end filter having an impulse response, and determining a temperature in response to the filtered output signal.
Public/Granted literature
- US20140086278A1 Temperature Measurement Circuitry and System Public/Granted day:2014-03-27
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