Invention Grant
- Patent Title: Imaging device, semiconductor manufacturing apparatus, and semiconductor manufacturing method
- Patent Title (中): 成像装置,半导体制造装置以及半导体制造方法
-
Application No.: US13912166Application Date: 2013-06-06
-
Publication No.: US09250196B2Publication Date: 2016-02-02
- Inventor: Akira Okabe , Masanori Tanoguchi , Junichi Tomizawa
- Applicant: Epicrew Corporation
- Applicant Address: JP Ohmuri-Shi
- Assignee: Epicrew Corporation
- Current Assignee: Epicrew Corporation
- Current Assignee Address: JP Ohmuri-Shi
- Agency: Gard & Kaslow LLP
- Priority: JP2013-019900 20130204
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G01N21/95 ; H01L21/67 ; H01L21/68

Abstract:
There are provided a susceptor having a recessed wafer mounting section, in which a semiconductor wafer is mounted and which is configured to include a circular bottom portion and a side wall portion, on an upper surface, a reaction chamber in which the susceptor is provided, an imaging unit that is provided above the reaction chamber and images the semiconductor wafer and the wafer mounting section, and an image analysis unit that analyzes the deviation of the semiconductor wafer from the wafer mounting section on the basis of an image captured by the imaging unit.
Public/Granted literature
- US20140220712A1 Imaging Device, Semiconductor Manufacturing Apparatus, and Semiconductor Manufacturing Method Public/Granted day:2014-08-07
Information query