A board inspection apparatus includes an irradiation unit, an imaging unit, and an image processing unit. The image processing unit includes a three-dimensional measurement unit configured to perform three-dimensional measurement of the surfaces of the solder and the resist film by a certain three-dimensional measurement method based on the image data, a virtual standard surface setting unit configured to set a virtual standard surface corresponding to a contacting surface of a certain component mounted in a certain area of the printed board, a protrusion amount calculation unit configured to calculate a protrusion amount from the virtual standard surface for each solder printed and formed in the certain area, and a determination unit configured to determine whether the printed state of the solder passes or fails based on each of the protrusion amounts of the solder.