Invention Grant
US09250262B1 Method and apparatus for an integrated isolation mechanical filter with substrate based package
有权
一种具有基板封装的集成隔离机械滤波器的方法和装置
- Patent Title: Method and apparatus for an integrated isolation mechanical filter with substrate based package
- Patent Title (中): 一种具有基板封装的集成隔离机械滤波器的方法和装置
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Application No.: US13757269Application Date: 2013-02-01
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Publication No.: US09250262B1Publication Date: 2016-02-02
- Inventor: Hemant Desai , Viresh P. Patel
- Applicant: Maxim Integrated Products, Inc.
- Applicant Address: US CA San Jose
- Assignee: Maxim Integrated Products, Inc.
- Current Assignee: Maxim Integrated Products, Inc.
- Current Assignee Address: US CA San Jose
- Agency: North Weber & Baugh LLP
- Main IPC: B81C1/00
- IPC: B81C1/00 ; G01P15/14
Abstract:
This invention relates generally to semiconductor manufacturing and packaging and more specifically to semiconductor manufacturing in MEMS (Microelectromechanical systems) inertial sensing products. Embodiments of the present invention provide a robust packaging process and a mechanical filter to reduce the mechanical shock from impact. The mechanical filter can be integrated within the package substrate as part of the packaging process, reducing the assembly complexity.
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