Invention Grant
- Patent Title: Active device array substrate
- Patent Title (中): 有源器件阵列衬底
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Application No.: US14313212Application Date: 2014-06-24
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Publication No.: US09250484B2Publication Date: 2016-02-02
- Inventor: Cheng Wang , Jen-Yang Chung , Kun-Cheng Tien , Wei-Chun Wei , Shin-Mei Gong , Ming-Huei Wu , Chien-Huang Liao
- Applicant: AU Optronics Corporation
- Applicant Address: TW Hsin-Chu
- Assignee: AU OPTRONICS CORPORATION
- Current Assignee: AU OPTRONICS CORPORATION
- Current Assignee Address: TW Hsin-Chu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW102145153A 20131209
- Main IPC: G02F1/1343
- IPC: G02F1/1343 ; H01L27/12 ; G02F1/1362

Abstract:
An active device array substrate includes a substrate, a first pixel electrode, and a first raised pattern. The first pixel electrode is disposed on or above the substrate, and the first pixel electrode includes a first truck electrode, a second truck electrode, and a plurality of first branch electrodes. The first truck electrode and the second truck electrode intersect to form a first node at the intersection of the first truck electrode and the second truck electrode. The first branch electrodes are connected to the first truck electrode and the second truck electrode to form a plurality of first domains, wherein the first branch electrodes are asymmetrical with respect to the second truck electrode. The first raised pattern is disposed at least between the first node and the substrate to form a first raised structure at least at the first node.
Public/Granted literature
- US20150160518A1 ACTIVE DEVICE ARRAY SUBSTRATE Public/Granted day:2015-06-11
Information query
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