Invention Grant
- Patent Title: Positive resist composition and patterning process
- Patent Title (中): 正抗蚀剂组成和图案化工艺
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Application No.: US14636590Application Date: 2015-03-03
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Publication No.: US09250522B2Publication Date: 2016-02-02
- Inventor: Jun Hatakeyama , Koji Hasegawa , Masayoshi Sagehashi
- Applicant: SHIN-ETSU CHEMICAL CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-041705 20140304
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; C08F220/30 ; C08F216/10 ; C08F220/68 ; C08F224/00
Abstract:
A positive resist composition is provided comprising a polymer comprising recurring units having a carboxyl or phenolic hydroxyl group substituted with an acid labile group and recurring units of 2-pyrone ester, and having a Mw of 1,000-500,000. The resist composition has a satisfactory effect of suppressing acid diffusion and a high resolution, and forms a pattern of good profile and minimal edge roughness after exposure.
Public/Granted literature
- US20150253665A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2015-09-10
Information query
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