Invention Grant
- Patent Title: Method for parametering a field device of process automation technology
- Patent Title (中): 过程自动化技术现场设备参数化方法
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Application No.: US13717965Application Date: 2012-12-18
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Publication No.: US09250615B2Publication Date: 2016-02-02
- Inventor: Jorg Hahniche , Immanuel Vetter , Julien Messer , Frank Birgel , Tobias Horn
- Applicant: Endress + Hauser Process Solutions AG
- Applicant Address: CH Reinach
- Assignee: Endress + Hauser Process Solutions AG
- Current Assignee: Endress + Hauser Process Solutions AG
- Current Assignee Address: CH Reinach
- Agency: Bacon & Thomas, PLLC
- Priority: DE102011089622 20111222
- Main IPC: G05B11/01
- IPC: G05B11/01 ; G05B19/042

Abstract:
A method for parametering a field device of process automation technology, wherein the field device has a certain number of device parameters, and wherein the method comprises the steps of providing a plurality of parametering modules, wherein at least one of the parametering modules specifies values for parameters of a first portion of the device parameters for parametering the field device; registering with an auxiliary module data, which relate to the application, in which the field device is to be applied; and selecting by means of the auxiliary module one of the parametering modules for parametering of the field device.
Public/Granted literature
- US20130173025A1 Method for parametering a field device of process automation technology Public/Granted day:2013-07-04
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