Invention Grant
- Patent Title: Methods and systems for fabricating integrated circuits utilizing universal and local processing management
- Patent Title (中): 利用通用和本地处理管理制造集成电路的方法和系统
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Application No.: US13833932Application Date: 2013-03-15
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Publication No.: US09250623B2Publication Date: 2016-02-02
- Inventor: Chinmay Oza , William John Fosnight
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee: GLOBALFOUNDRIES, INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G05B19/418

Abstract:
Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method of semiconductor fabrication includes performing a process on substrates with an equipment unit to form processed substrates, communicating processing data from the equipment unit to a local scheduler and a universal scheduler, determining a priority of the processed substrates, and scheduling removal of processed substrates from the equipment unit and delivery of unprocessed substrates to the equipment unit by the local scheduler based on the processing data and the priority of the processed substrates.
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