Invention Grant
- Patent Title: IHS component cooling system
- Patent Title (中): IHS部件冷却系统
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Application No.: US13404761Application Date: 2012-02-24
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Publication No.: US09250664B2Publication Date: 2016-02-02
- Inventor: Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
- Applicant: Paul T. Artman , Dominick Adam Lovicott , Hasnain Shabbir
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: G06F1/20
- IPC: G06F1/20

Abstract:
An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.
Public/Granted literature
- US20130226364A1 IHS COMPONENT COOLING SYSTEM Public/Granted day:2013-08-29
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