Invention Grant
- Patent Title: Damping structure for tape head system
- Patent Title (中): 磁带头系统阻尼结构
-
Application No.: US14195187Application Date: 2014-03-03
-
Publication No.: US09251847B2Publication Date: 2016-02-02
- Inventor: Walter Haeberle , Mark A Lantz , Hugo E Rothuizen
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Jeff Tang
- Main IPC: G11B5/54
- IPC: G11B5/54 ; G11B5/55 ; G11B21/24 ; G11B5/008 ; G11B33/08 ; G11B5/48
Abstract:
A tape head system. The tape head system includes: a head for reading from and/or writing to magnetic tape; a support; and at least one leaf spring assembly supporting the head moveably relative to the support so as to allow the head to follow a motion of the tape, the at least one leaf spring assembly including at least one leaf spring and at least one damping element configured for damping a motion of the head relative to the support.
Public/Granted literature
- US20150248915A1 TAPE HEAD SYSTEM Public/Granted day:2015-09-03
Information query
IPC分类:
