Invention Grant
US09252018B2 High-k/metal gate transistor with L-shaped gate encapsulation layer
有权
具有L形栅极封装层的高k /金属栅极晶体管
- Patent Title: High-k/metal gate transistor with L-shaped gate encapsulation layer
- Patent Title (中): 具有L形栅极封装层的高k /金属栅极晶体管
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Application No.: US13571977Application Date: 2012-08-10
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Publication No.: US09252018B2Publication Date: 2016-02-02
- Inventor: Renee T. Mo , Wesley C. Natzle , Vijay Narayanan , Jeffrey W. Sleight
- Applicant: Renee T. Mo , Wesley C. Natzle , Vijay Narayanan , Jeffrey W. Sleight
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini & Bianco PL
- Agent Thomas Grzesik
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/28 ; H01L29/49 ; H01L29/51 ; H01L29/66

Abstract:
A transistor is provided that includes a silicon layer with a source region and a drain region, a gate stack disposed on the silicon layer between the source region and the drain region, an L shaped gate encapsulation layer disposed on sidewalls of the gate stack, and a spacer disposed above the horizontal portion of the gate encapsulation layer and adjacent to the vertical portion of the gate encapsulation layer. The gate stack has a first layer of high dielectric constant material, a second layer comprising a metal or metal alloy, and a third layer comprising silicon or polysilicon. The gate encapsulation layer has a vertical portion covering the sidewalls of the first, second, and third layers of the gate stack and a horizontal portion covering a portion of the silicon layer that is adjacent to the gate stack.
Public/Granted literature
- US20120299122A1 HIGH-K/METAL GATE TRANSISTOR WITH L-SHAPED GATE ENCAPSULATION LAYER Public/Granted day:2012-11-29
Information query
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