Invention Grant
- Patent Title: Hybrid microwave integrated circuit
- Patent Title (中): 混合式微波集成电路
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Application No.: US12140445Application Date: 2008-06-17
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Publication No.: US09252067B1Publication Date: 2016-02-02
- Inventor: Mahesh Kumar
- Applicant: Mahesh Kumar
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Howard IP Law Group, PC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/36 ; H01L23/66

Abstract:
An integrated microwave transistor amplifier includes a AlGaN/GaN active transistor arrangement on a thinned Si 1-mil heat spreader. Elongated, plated-through vias extend from the source portions of the transistor arrangement through the spreader to a thick gold supporting layer. A matching circuit is defined on a four-mil GaAs substrate, also with a thick gold support layer. A stepped heat sink supports the matching circuit and the active transistor with surfaces coplanar. Bond wires interconnect the matching circuit with the gate or drain connections of the transistor.
Information query
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