Invention Grant
- Patent Title: Package vias for radio frequency antenna connections
- Patent Title (中): 射频天线连接的通孔
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Application No.: US14037213Application Date: 2013-09-25
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Publication No.: US09252077B2Publication Date: 2016-02-02
- Inventor: Wolfgang Molzer , Edmund Goetz , Reinhard Mahnkopf , Bernd Memmler
- Applicant: Wolfgang Molzer , Edmund Goetz , Reinhard Mahnkopf , Bernd Memmler
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
Public/Granted literature
- US20150084194A1 PACKAGE VIAS FOR RADIO FREQUENCY ANTENNA CONNECTIONS Public/Granted day:2015-03-26
Information query
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