Invention Grant
- Patent Title: Package for an integrated circuit
- Patent Title (中): 集成电路封装
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Application No.: US14077138Application Date: 2013-11-11
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Publication No.: US09252085B2Publication Date: 2016-02-02
- Inventor: Christian Weinschenk
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: Samba Holdco Netherlands B.V.
- Current Assignee: Samba Holdco Netherlands B.V.
- Current Assignee Address: NL Eindhoven
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/49 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
The invention refers to method for packaging an integrated circuit (IC) comprising steps of: attaching at least one die on a substrate; attaching bond-wires from the die(s) to package terminal pads; mold or dispense a thermo-degradable material on the substrate, die(s) and bond-wires; mold an encapsulant material; decompose the thermo-degradable materials by temperature treatment.
Public/Granted literature
- US20140131899A1 PACKAGE FOR AN INTEGRATED CIRCUIT Public/Granted day:2014-05-15
Information query
IPC分类:
