Invention Grant
- Patent Title: Electronic circuit, production method thereof, and electronic component
- Patent Title (中): 电子电路及其制造方法以及电子部件
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Application No.: US13951324Application Date: 2013-07-25
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Publication No.: US09252087B2Publication Date: 2016-02-02
- Inventor: Rei Yoneyama , Nobuya Nishida , Hiroyuki Okabe
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2012-252857 20121119
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/053 ; H01L21/56 ; H01L23/13 ; H01L23/373 ; H01L23/498 ; H01L23/00 ; H01L23/24
Abstract:
An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
Public/Granted literature
- US20140138706A1 ELECTRONIC CIRCUIT, PRODUCTION METHOD THEREOF, AND ELECTRONIC COMPONENT Public/Granted day:2014-05-22
Information query
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