Invention Grant
- Patent Title: Resin package
- Patent Title (中): 树脂包装
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Application No.: US13980336Application Date: 2013-02-14
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Publication No.: US09252090B2Publication Date: 2016-02-02
- Inventor: Kazuhiro Yahata , Takashi Uno , Hikaru Ikeda
- Applicant: Panasonic Corporation
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack LLP
- Priority: JP2012-075061 20120328
- International Application: PCT/JP2013/000817 WO 20130214
- International Announcement: WO2013/145532 WO 20131003
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/495 ; H01L23/31 ; H01L23/13
Abstract:
A resin package includes: a die pad having a main surface on which a semiconductor substrate and a matching circuit substrate is mounted; at least one lead terminal electrically connected to the semiconductor substrate and the matching circuit substrate; a thin plate fixed to at least one of the main surface of the die pad and a main surface of the at least one lead terminal; and molding resin which covers the semiconductor substrate, the matching circuit substrate, and the thin plate.
Public/Granted literature
- US20140239470A1 RESIN PACKAGE Public/Granted day:2014-08-28
Information query
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