Invention Grant
- Patent Title: Semiconductor package and method of fabricating the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13922722Application Date: 2013-06-20
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Publication No.: US09252095B2Publication Date: 2016-02-02
- Inventor: Jongkook Kim , Su-min Park , Soojeoung Park , Bona Baek , Hohyeuk Im , Byoungwook Jang , Yoonha Jung
- Applicant: Jongkook Kim , Su-min Park , Soojeoung Park , Bona Baek , Hohyeuk Im , Byoungwook Jang , Yoonha Jung
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., LTD.
- Current Assignee: Samsung Electronics Co., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2012-0074722 20120709
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/56 ; H01L23/00 ; H01L23/13 ; H01L25/065 ; H01L25/10 ; H01L23/31
Abstract:
Provided are a semiconductor package and a method of fabricating the same. The package substrate includes a hole, which may be used to form a mold layer without any void. The mold layer may be partially removed to expose a lower conductive pattern. Accordingly, it is possible to improve routability of solder balls.
Public/Granted literature
- US20140008795A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME Public/Granted day:2014-01-09
Information query
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