Invention Grant
US09252124B2 Circuit module having a substrate, semiconductor chip, and molding material formed by dicing
有权
电路模块具有通过切割形成的基板，半导体芯片和成型材料
- Patent Title: Circuit module having a substrate, semiconductor chip, and molding material formed by dicing
- Patent Title (中): 电路模块具有通过切割形成的基板，半导体芯片和成型材料
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Application No.: US14515851Application Date: 2014-10-16
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Publication No.: US09252124B2Publication Date: 2016-02-02
- Inventor: Masashi Inoue
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-219025 20131022
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/29 ; H01L23/34 ; H01L23/02 ; H01L23/00 ; H01L21/78 ; H01L21/56
Abstract:
A circuit module including: a wiring substrate having a shape elongated in one direction; a semiconductor chip mounted on the wiring substrate; and a molding material that molds the semiconductor chip, wherein end faces of the molding material that extend along a lengthwise direction of the wiring substrate and intersect with a lateral direction of the wiring substrate are formed by dicing performed along end faces of a partial region of the wiring substrate.
Public/Granted literature
- US20150108665A1 CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-04-23
Information query
IPC分类:
