A semiconductor device includes an analog integrated circuit and a digital integrated circuit provided on a major surface of a substrate. An analog ground terminal is provided for the analog integrated circuit, and digital ground terminals are provided for the digital integrated circuit. An analog ground layer is stacked on the substrate so as to face the analog integrated circuit, and digital ground layers are stacked on the substrate so as to face the digital integrated circuit. The analog ground terminal is connected to the analog ground layer, and the digital ground terminals are connected to the digital ground layers, respectively.