Invention Grant
- Patent Title: Semiconductor chip and semiconductor arrangement
- Patent Title (中): 半导体芯片和半导体布置
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Application No.: US13427344Application Date: 2012-03-22
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Publication No.: US09252140B2Publication Date: 2016-02-02
- Inventor: Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
- Applicant: Gerhard Zojer , Daniel Auer , Gerrit Utz , Claudia Kabusch
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/66 ; H01L21/70 ; H01L29/06 ; H01L23/34 ; H01L27/02 ; H01L23/367 ; B60R21/017 ; H01L27/06

Abstract:
One aspect of the invention relates to a semiconductor chip with a semiconductor body. The semiconductor body has an inner region and a ring-shaped outer region. An electronic structure is monolithically integrated in the inner region and has a controllable first semiconductor component with a first load path and a first control input for controlling the first load path. Further, a ring-shaped second electronic component is monolithically integrated in the outer region and surrounds the inner region. Moreover, the second electronic component has a second load path that is electrically not connected in parallel to the first load path.
Public/Granted literature
- US20130249018A1 Semiconductor Chip and Semiconductor Arrangement Public/Granted day:2013-09-26
Information query
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