In the present disclosure, it is provided an array substrate including a pad area, signal lines arranged on the substrate, conductive connection lines arranged at least on the pad area and directly connected to a flexible circuit, and conductive connection lines arranged at least on the pad area and directly connected to a flexible circuit. The conductive connection lines may be connected to the signal lines through a via hole, and may include a first wire and a second wire electrically connected to each other. The second wire may be arranged in such a manner that a contact area between the conductive connection lines and the flexible circuit is not less than a predetermined threshold when the flexible circuit is displaced in a first direction relative to the first wire. The first direction may be substantially perpendicular to an extending direction of the first wire.