Invention Grant
- Patent Title: Solid state imaging device
- Patent Title (中): 固态成像装置
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Application No.: US13603255Application Date: 2012-09-04
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Publication No.: US09252177B2Publication Date: 2016-02-02
- Inventor: Yoshitaka Egawa
- Applicant: Yoshitaka Egawa
- Applicant Address: JP Tokyo
- Assignee: Kabuhiki Kaisha Toshiba
- Current Assignee: Kabuhiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2012-004059 20120112
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
According to one embodiment, a solid state image sensor has a photoelectric conversion element array, a light collecting optical element array, wavelength-selective elements and a reflecting unit. Wavelength-selective elements pass light of the color which is to be detected, and reflect other colors. The reflecting unit further reflects the light that has been reflected by the wavelength-selective elements. The cell includes photoelectric conversion elements for three different light colors. A microlens serving as a light collecting optical element is arranged corresponding to the cell. The reflecting unit includes at least a first reflecting surface and a second reflecting surface. The first reflecting surface faces the wavelength-selective elements. In every cell, the second reflecting surface is enclosed between wavelength-selective elements and the first reflecting surface.
Public/Granted literature
- US20130182155A1 SOLID STATE IMAGING DEVICE Public/Granted day:2013-07-18
Information query
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