Invention Grant
- Patent Title: Integrated inductor and integrated inductor fabricating method
- Patent Title (中): 集成电感器和集成电感器制造方法
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Application No.: US14203474Application Date: 2014-03-10
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Publication No.: US09252199B2Publication Date: 2016-02-02
- Inventor: Ta-Hsun Yeh
- Applicant: Realtek Semiconductor Corp.
- Applicant Address: TW Science Park, HsinChu
- Assignee: Realtek Semiconductor Corp.
- Current Assignee: Realtek Semiconductor Corp.
- Current Assignee Address: TW Science Park, HsinChu
- Agent Winston Hsu; Scott Margo
- Priority: TW102110077A 20130321
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L21/768 ; H01L29/16 ; H01L23/522 ; H01L23/64 ; H01L25/065 ; H01L23/48

Abstract:
The present invention provides an integrated inductor and an integrated inductor fabricating method. The integrated inductor comprises: a semiconductor substrate, a plurality of deep trenches, and an inductor. The deep trenches are formed in the semiconductor substrate and arranged in a specific pattern, and the deep trenches are filled with a metal material to form a patterned ground shield (PGS). The inductor is formed above the semiconductor substrate. The integrated inductor fabricating method comprises: forming a semiconductor substrate; forming a plurality of deep trenches in the semiconductor substrate and arranging the deep trenches in a specific pattern; filling the deep trenches with a metal material to form a patterned ground shield (PGS); and forming an inductor above the semiconductor substrate.
Public/Granted literature
- US20140284762A1 INTEGRATED INDUCTOR AND INTEGRATED INDUCTOR FABRICATING METHOD Public/Granted day:2014-09-25
Information query
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