Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14158381Application Date: 2014-01-17
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Publication No.: US09252210B2Publication Date: 2016-02-02
- Inventor: Masatoshi Aketa
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Rabin & Berdo, P.C.
- Priority: JP2011-084715 20110406; JP2011-143179 20110628
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/06 ; H01L29/16 ; H01L29/66 ; H01L29/872 ; H01L29/47

Abstract:
A semiconductor device capable of decreasing a reverse leakage current and a forward voltage is provided. In the semiconductor device, an anode electrode undergoes Schottky junction by being connected to a surface of an SiC epitaxial layer that has the surface, a back surface, and trapezoidal trenches formed on the side of the surface each having side walls and a bottom wall. Furthermore, an edge portion of the bottom wall of each of the trapezoidal trenches is formed to be in the shape bent towards the outside of the trapezoidal trench in the manner that a radius of curvature R satisfies 0.01 L
Public/Granted literature
- US20140131738A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-05-15
Information query
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