Invention Grant
- Patent Title: Semiconductor component with a space saving edge structure
- Patent Title (中): 半导体元件具有节省空间的边缘结构
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Application No.: US13330205Application Date: 2011-12-19
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Publication No.: US09252251B2Publication Date: 2016-02-02
- Inventor: Franz Hirler , Ralf Siemieniec , Christian Geissler , Oliver Blank , Maximilian Roesch
- Applicant: Franz Hirler , Ralf Siemieniec , Christian Geissler , Oliver Blank , Maximilian Roesch
- Applicant Address: AU Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AU Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006036347 20060803
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/66 ; H01L29/78 ; H01L29/861 ; H01L29/872 ; H01L29/06 ; H01L29/40 ; H01L29/423
Abstract:
A semiconductor component is disclosed. One embodiment includes a semiconductor body including a first semiconductor layer having at least one active component zone, a cell array with a plurality of trenches, and at least one cell array edge zone. The cell array edge zone is only arranged in an edge region of the cell array, adjoining at least one trench of the cell array, and being at least partially arranged below the at least one trench in the cell array.
Public/Granted literature
- US20120153386A1 SEMICONDUCTOR COMPONENT WITH A SPACE SAVING EDGE STRUCTURE Public/Granted day:2012-06-21
Information query
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